Availability: 4" wafer (#16010) is precut into 3 x 3mm, 5 x 7mmm, 5 x 5mm, 10 x 10mm, 20 x 20 mm or 20 x 30mm chips that can be easily separated in the laboratory.

• 4" wafer precut into 3 x 3mm chips approximately 600 chips/wafer
• 4" wafer precut into 5 x 7mm chips approximately 187 chips/wafer
• 4" wafer precut into 5 x 5mm chips approximately 270 chips/wafer
• 4" wafer precut into 10 x 10mm chips approximately 55 chips/wafer
• 4" wafer precut into 20 x 20mm chips approximately 10 chips/wafer
• 4" wafer precut into 20 x 30mm chips approximately 6 chips/wafer

Properties:

• Orientation: <100>
• Resistivity: 1-30 Ohm-cm
• Type: P (Boron) (1 primary flat)
• No SiO2 top coating
• Wafer thickness: 18-21 mil (460-530µm)
• Wafer is polished on one side
• Roughness: 2nm
• Before dicing they are rinsed in de-ionized water for cleaning