The excellent thermal and electrical conductivity, coupled with the absence of hydrocarbons, makes this product ideal for demanding specimen preparation in FESEM, XPS, ESCA, SIMS, Auger and other applications. PELCO® High Performance Silver Paste provides both high electrical and thermal conductivity with a silver particle size of 20µm. Silver content >60% by weight. Cures at room temperature, but requires a 2 hour cure at 93°C (200°F) to achieve high conductivity and strong bond. Must be fully cured before using this product at cryogenic temperatures. Soluble in water to 260°C (500°F). Above this temperature it becomes almost insoluble.
For nonconductive, high temperature adhesive try Product #16026.